CLE-115-01-G-DV-K-TR

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See Product Specifications for product details.
Buy CLE-115-01-G-DV-K-TR with confidence from Components-World.HK, 1 Year Warranty
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| Part Number | CLE-115-01-G-DV-K-TR |
|---|---|
| Manufacturer | Samtec, Inc. |
| Description | .8MM MICRO SOCKET STRIPS |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Reference Price (In US Dollars) | 125 pcs | ||||
|---|---|---|---|---|---|
| $1.304 | |||||
- Product parameter
- Data sheet
Product parameter
| Part Number | CLE-115-01-G-DV-K-TR | Manufacturer | Samtec, Inc. |
|---|---|---|---|
| Description | .8MM MICRO SOCKET STRIPS | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Quantity Available | 27259 pcs | Data sheet | CLE Series DrawingCLE Series DatasheetCLE Vertical/Pass Through Footprint |
| Category | Connectors, Interconnects | Voltage Rating | - |
| Termination | Solder | Style | Board to Board |
| Series | CLE | Row Spacing - Mating | 0.047" (1.20mm) |
| Pitch - Mating | 0.031" (0.80mm) | Packaging | Tape & Reel (TR) |
| Operating Temperature | -55°C ~ 125°C | Number of Rows | 2 |
| Number of Positions Loaded | All | Number of Positions | 30 |
| Mounting Type | Surface Mount | Material Flammability Rating | UL94 V-0 |
| Mated Stacking Heights | - | Manufacturer Standard Lead Time | 3 Weeks |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Insulation Material | Liquid Crystal Polymer (LCP) |
| Insulation Height | 0.130" (3.30mm) | Insulation Color | Black |
| Ingress Protection | - | Features | Pick and Place |
| Fastening Type | Push-Pull | Detailed Description | 30 Position Receptacle, Pass Through Connector Surface Mount |
| Current Rating | 2.7A per Contact | Contact Type | Female Socket |
| Contact Shape | Square | Contact Material | Beryllium Copper |
| Contact Length - Post | - | Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) | Contact Finish - Post | Gold |
| Contact Finish - Mating | Gold | Connector Type | Receptacle, Pass Through |
| Applications | - |
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