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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors > BU200Z-178-HT

BU200Z-178-HT

BU200Z-178-HT
OMRON AUTOMATION & SAFETYImages are for reference only.
See Product Specifications for product details.
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Part Number BU200Z-178-HT
Manufacturer On-Shore Technology, Inc.
Description CONN IC DIP SOCKET 20POS GOLD
Lead Free Status / RoHS Status Lead free / RoHS Compliant
In Stock 54778 pcs
Reference Price
(In US Dollars)
1 pcs10 pcs25 pcs50 pcs100 pcs
$1.301$1.249$1.145$1.093$1.041
250 pcs500 pcs1000 pcs2500 pcs 
$0.911$0.885$0.755$0.703 

Submit a Request For Quotation on quantities greater than those displayed.

Target Price:(USD)
Quantity:
Total:
$1.301

Product parameter

Part Number BU200Z-178-HT Manufacturer On-Shore Technology, Inc.
Description CONN IC DIP SOCKET 20POS GOLD Lead Free Status / RoHS Status Lead free / RoHS Compliant
Quantity Available 54778 pcs Data sheet BU-xx0Z-178HT Drawing
Category Connectors, Interconnects Type DIP, 0.3" (7.62mm) Row Spacing
Termination Post Length 0.059" (1.50mm) Termination Solder
Series BU-178HT Pitch - Post 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm) Packaging Tube
Other Names BU200Z178HT
ED2206
Operating Temperature -55°C ~ 125°C
Number of Positions or Pins (Grid) 20 (2 x 10) Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited) Material Flammability Rating UL94 V-0
Manufacturer Standard Lead Time 12 Weeks Lead Free Status / RoHS Status Lead free / RoHS Compliant
Housing Material Polybutylene Terephthalate (PBT), Glass Filled Features Open Frame
Current Rating 1A Contact Resistance 7 mOhm
Contact Material - Post Brass Contact Material - Mating Beryllium Copper
Contact Finish Thickness - Post Flash Contact Finish Thickness - Mating 78.7µin (2.00µm)
Contact Finish - Post Copper Contact Finish - Mating Gold

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